Assistant Professor, School of Mechanical, Aerospace and Manufacturing Engineering
| kyungjin.kim@uconn.edu | |
| Mailing Address | School of Mechanical, Aerospace, and Manufacturing Engineering, University of Connecticut, 191 Auditorium Rd. U-3139, Storrs, CT 06269 |
| Campus | Storrs |
Brief Bio
Prof. Kyungjin Kim joined the Department of Mechanical Engineering at the University of Connecticut in Fall 2021. Before joining, she was a postdoctoral fellow in the Lacour lab at the École Polytechnique Fédérale de Lausanne (EPFL), Switzerland, working on the chronic soft neuroprosthetic implants. She received her PhD from the Georgia Institute of Technology, USA in 2018 and BS from KAIST, South Korea, in 2014 both in Mechanical Engineering. She is currently developing long-term functioning soft and deformable electronic devices using vacuum processed hermetic encapsulations and various quality control methods, ultimately to engineer the reliability of next-generation devices such as flexible and stretchable electronics, implantable bioelectronics both in the materials and device level.
She is also interested in other applications: smart packaging of food and pharma-, composite materials in aircraft/naval engineering, where optimizations and reliability analysis of nanocomposite materials, barrier materials, fatigue and fracture of materials are required, building interdisciplinary research towards microengineering, materials science, and biomedical engineering.
- Design of Machine Elements
- Introduction to Fatigue in Mechanical Design
- Diyaroglu, C., Villanueva, R., Raza, U., Oterkus, S., Oterkus, E. and Kim, K., "Full range fragmentation simulation of nanoflake filler-matrix composite coatings on a polymer substrate." Extreme Mechanics Letters, 2024
- Diyaroglu, C., Mohammadi Anaei, M., Kim, K.,* ”A Finite Element Framework on Water Vapor Transmission Rates by Pinhole Damages in Inorganic Ultrabarriers for Flexible Electronics,” Applied Surface Science, 2024. (featured online)
- Raza, U., Niemiec, M., Kim, K.,* “Polyisobutylene Encapsulated PEDOT: PSS Electrode Honeycomb Skeleton Electrolyte for MoistureResistant Electro-Ionic Soft Artificial Muscles,” Advanced Materials Technologies, 2023.
- Diyaroglu,C., Mohammadi Anaei, M., Kim, K.,* “A Computational Framework on Pinhole Damage in Ultrathin Barriers for FlexibleElectronics Encapsulation,” IEEE 32nd Electrical Performance of Electronics Packaging and Systems, 2023.
- Niemiec, M., and Kim, K.,* “Lifetime engineering of bioelectronic implants with mechanically reliable thin film encapsulations,” Progress in Biomedical Engineering, 2023.
- Song, S., Fallegger, F.,Trouillet, A., Kim, K., Lacour, S.,* “Deployable Electrocorticography(ECoG) systems assisted with soft robotic actuation,” Science Robotics, 2023.
- Kathe, C.,* Skinnider, M.,* Hutson, T.,* Regazzi, N., Gautier, M., Demesmaeker, R., Komi, S., Ceto, S., James, N., Cho, N., Baud, L., Galan, K., Matson, K., Rowald, A., Kim, K., Wang, R., Prior, J., Asboth, L., Barraud, Q., Lacour, S., Levine, A., Wagner, F., Bloch, J.,# Squair, J.,# Courtine, G.,# “The neurons that restore walking after paralysis,” Nature, 2022.
- Mariello M, Kim, K, Wu, K, Lacour SP, Leterrier Y. “Recent advances in encapsulation of flexible bioelectronic implants: materials, technologies and characterization methods,” Advanced Materials. 2022.
- Kathe, C.,* Michoud, F.,* Schönle, P.,* Rowald, A., Brun, N., Ravier, J., Furfaro, I., Paggi, V., Kim, K., Soloukey, S., Asboth, L., Hutson, T.H., Jelescu, I., Philippides, A., Alwahab, N., Gandar, J., Huber, D., De Zeeuw, C.I., Barraud, Q., Huang, Q., Lacour, S.,# and Courtine, G.,# “Wireless closed-loop optogenetics across the entire dorsoventral spinal cord in ecological environments,” Nature Biotechnology, pp.1-11, 2022.
- Kim et al., “Extended barrier lifetime of partially cracked organic/inorganic multilayers for compliant implantable electronics,” Small, 17(40), p.2103039, 2021."
- Park et al., "Skin-like low-noise elastomeric organic photodiodes." Science Advances, 7(51), p.eabj6565, 2021.
- Kim et al., “Optimizing crack onset strain for Silicon Nitride / Fluoropolymer Nanolaminate Barrier Films,” ACS Applied Nano Materials, 2 (4), pp.2525-2532, 2019.
- Kim et al., “Environmentally Assisted Cracking in Silicon Nitride Barrier Films on Poly (ethylene terephthalate) Substrates,” ACS applied materials & interfaces, 8(40), pp.27169-27178, 2016.